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Chip EMIFIL Chip Capacitor 2.2uF 10 Volt DC 4 Ampere Current muRata NFM18PC225B1A3D for Electronic Devices

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Chip EMIFIL Chip Capacitor 2.2uF 10 Volt DC 4 Ampere Current muRata NFM18PC225B1A3D for Electronic Devices

Nominal Capacitance : 2.2uF

Operating Temperature : -40℃~+85℃

Voltage Rating : 10V

Tolerance : ±20%

DC Resistance(DCR) : 10mΩ

Current Rating : 4A

Description : 2.2uF ±20% 10mΩ SMD-3P,1.6x0.8mm Feed Through Capacitors RoHS

Mfr. Part # : NFM18PC225B1A3D

Model Number : NFM18PC225B1A3D

Package : SMD-3P,1.6x0.8mm

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Product Overview

The NFM18PC225B1A3 is a Chip EMIFIL Chip 3-terminal Capacitor designed for large current applications in general electronic equipment. It offers a capacitance of 2.2uF and a DC rated voltage of 10V, with a rated current of 4A (DC).

Product Attributes

Brand: MURATA
Product Type: Chip EMIFIL Chip 3-terminal Capacitor for Large Current
Packaging: 7) Packaging Code (W8P4, 4000 pcs./Reel)

Technical Specifications

Item	Specification	Test Method
Capacitance	2.2 uF	Frequency : 1.00.1kHz (Cap.) Voltage : 10.2V(rms)
Capacitance Tolerance	20 %
DC Rated Voltage	10 V	Rated Voltage x 300% Time : 1 to 5 s
Rated Current	4A(DC)
DC Resistance	10mmax.	Measured with 100mA max.
Insulation Resistance	0.250.1 200Mmin.	Voltage : Rated Voltage Time : 2 minutes max.
Operating Temperature Range	-40 to 85 C
Storage Temperature Range	-40 to 85 C
Dimensions (L x W x T)	1.60.1 x 0.80.1 x 0.80.1 mm
Appearance	No defects or abnormalities.	Visual inspection.
Solderability	Electrodes shall be at least 90% covered with new solder coating.	Flux: Ethanol solution of rosin, 25(wt)%. Pre-heat: 15010C, 60 to 90s. Solder: Sn-3.0Ag-0.5Cu. Solder Temperature: 240 3C. Immersion Time: 31 s.
Resistance to soldering heat	Appearance No damaged, Cap. Change Within 7.5%, DC Resistance 0.05 max.	Flux: Ethanol solution of rosin, 25(wt)%. Pre-heat: 15010C, 60 to 90s. Solder: Sn-3.0Ag-0.5Cu. Solder Temperature: 270 5C. Immersion Time: 10 1 s.
Bending Strength	Deflection 2 mm, Keeping Time 30 s	Soldered on glass-epoxy substrate (100401.0mm).
Drop	Height: 1m, Method: Free fall, Attitude: 3 directions	Dropped on concrete or steel board.
Bonding Strength	Applying Force (F): 9.8 N, Applying Time: 10 s	Soldered on glass-epoxy substrate.
Vibration	Oscillation Frequency: 10 to 2000 to 10Hz for 20 minute. Total amplitude 1.5 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time: 2 hours in each of 3 mutually perpendicular directions.	Soldered on glass-epoxy substrate. Preconditioning: Heat treatment (150+0 / -10 C,1hour).
Temperature Cycling	-55C (30 min) to +125C (30 min) per cycle, 10 cycles	Soldered on glass-epoxy substrate.
Humidity	402C, 90 to 95%(RH), 500 hours	Soldered on glass-epoxy substrate.
Heat Life	Maximum Operating Temperature 2 C, Rated Voltage x 200%, 1000 hours	Soldered on glass-epoxy substrate.

2410121725_muRata-NFM18PC225B1A3D_C113151.pdf

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